Vishay's thin film solutions engineering team works with you to configure or create assemblies that standard topologies can't achieve. Whether you need a modified pinout, a non-standard die combination, or a fully application-specific module for a demanding application, we have the process, materials, and manufacturing scale to deliver it.
Start from one of Vishay's existing module families and work with our engineers to adapt it to your specific requirements. Faster to qualify, lower NRE cost, and suitable for designs where a standard topology gets you most of the way there.
Common modification requests
When your application demands a topology, form factor, or performance envelope that no existing module can meet, our engineering team designs from the ground up. From initial spec through prototype validation and into volume production.
Custom Service designs developed through this program are created exclusively for you. We do not add customer-specific designs to our general product catalog or make them available to any other party. Your requirements, your specifications, and your intellectual property remain confidential throughout every stage of our engagement.
A brief description of your project is all that is needed to start. Our team will ask for more detail once we have reviewed what you have shared.
A member of our engineering team will contact you directly to discuss your requirements, ask questions, and assess whether your project is a good fit for our capabilities.
Thin Film solutions we have delivered.
Challenge
The customer approached Vishay when their existing panel potentiometer supplier discontinued production of a part used on an established and popular piece of equipment. To avoid a costly redesign, an existing panel potentiometer needed to be adapted to meet the customer’s electrical requirements. It would also have to fit the control panel insertion / retention envelope and existing markings, in addition to the PCB assembly attachment system.
Tell us about your application and a Vishay application engineer will follow up to discuss requirements, feasibility, and next steps. There is no commitment required to start the conversation.
Common new-design requests
If the project is feasible, we will present a recommended approach. There is no commitment at any stage until you choose to move forward.
Challenge
Our customer was evaluating a solution for power electronics equipment that required the use of several DC-Link capacitors on the same PCB, while ensuring that the devices would support critical vibration profiles. The products being considered for the application had a significantly high mass of around 100 g, and were attached to the PCB via four lead wires with 1.2 mm diameters. While testing these parts under severe vibration profiles, the customer reported broken lead wires. The challenge was clear: how can such high mass parts withstand severe vibration profiles, while maintaining a similar footprint on the PCB?
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