Our innovative options address engineering challenges, including those related to power, sensing, and signal integrity. These timely product launch updates shorten the discovery to specification cycle by providing engineers with key performance metrics as well as application highlights.

Enable a reliable data transmission line that is robust against cyber-attacks and immune to EMC and EMI / RFI interference

Increase power conversion efficiency in energy and industrial applications, while eliminating the need for PCB redesigns

Surface Mount Power Resistor, Thick Film Technology, TO-263 Top Side Cooling

Simplify Device Selection and Validation, While Reducing Time to Market

10 % Lower Profile and 20 % Higher Current Ratings than Devices in the SMPC (TO-277A)
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