For over 60 years, Vishay engineers have worked alongside design teams to create components that standard catalogs can't supply. From single-run prototypes to full production scale, we serve every major industry with the same engineering depth and manufacturing infrastructure.
What We Offer
Design an application-specific product
When your application has no existing analog, our engineering teams work from your design requirements up. We collaborate from initial concept through prototype validation and into production-ready manufacturing.
Typical Requests
Application-specific multi-component assemblies, novel material combinations, hybrid integrated designs, extreme environment specifications.
Re-configure an existing product
Sometimes a standard component gets you 90% of the way there. Our engineers can adjust tolerances, packaging, electrical characteristics, or form factor to close that gap without the lead time or cost of a ground-up design.
Typical Requests
Tighter tolerance specs, configuration termination styles, modified voltage ratings, alternative package footprints.
Select your component type to get started.
Bridge, IGBT, MOSFET assemblies
Film, tantalum, ceramic and more
Power, protection, signal and switching
Clock oscillators and quartz crystals
Position, temperature, non-contacting
Chip, wirewound, high-voltage
Power protection, regulation, control and drivers
Sensors, LEDs, couplers and isolation
RF resistors, attenuators, networks and filters
Inductors, transformers, planar
Silicon, SiC and dual MOSFETs
How it works.
Every Design-In Solutions engagement starts with a conversation and ends with a component built to your specification. What happens in between depends on the complexity of your project, the component type, and how far along your design is when we connect. Our engineering teams work at every stage, from early concept to production validation, and we will be direct with you about what your project requires.
Proof Through Case Studies
Design-In Solutions, delivered across industries.
Eliminate Linearity Errors and Increase Repeatability With a Displacement Sensor Eliminate Linearity Errors and Increase Repeatability With a Displacement Sensor
Challenge
Membrane potentiometers measure mechanical position by elastic deformation of their upper membrane. This position is used in the control loop of an electrical actuator’s motion. In outdoor applications, these membranes can suffer from a memory effect phenomenon when the sensor is in a frozen position caused by exposure to harsh weather conditions, like a mix of temperature and humidity for extended periods. Typically, such conditions affect the membrane and create a permanent deformation that causes future measurements to be inaccurate. For our customer, this phenomenon was not only creating linearity errors, but it was also decreasing the repeatability of the actuator’s performance. Specifically, the customer was looking for a repeatability tolerance of ± 0. 2% across the life of the system, which was unachievable with a standard design.
Electrical and Mechanical Instability Under Severe Environmental Stress
Challenge
A systems engineer supporting a long-life aerospace and defense program was tasked with delivering electronics capable of surviving extreme environmental exposure. The system would operate under repeated shock and vibration events, wide thermal cycling, vacuum transitions, radiation exposure, humidity excursions, and strict contamination control protocols. The electrical design met initial performance requirements, but environmental testing began to expose weaknesses in the packaging platform. Over extended qualification cycles, the program encountered instability tied not to the active devices, but to the substrate and interconnect structure supporting them. Failure mechanisms began to emerge: Electrical drift after thermal cycling due to material expansion mismatch Micro-cracking and metallization fatigue under vibration Moisture ingress and contamination risk in non-hermetic interconnect paths Bond line instability impacting long-term die attach reliability Process variation requiring requalification and documentation review Because the program required strict configuration control and long-term traceability, even minor material or process adjustments triggered costly requalification cycles. Schedule risk increased as environmental margin narrowed. The team realized the issue was not component performance — it was platform stability under stress .
mmWave Loss and Unstable Performance in a Satellite Payload
Challenge
While developing a next‑generation Ka‑band and W‑band satellite payload for a low‑Earth‑orbit communications constellation, an RF systems engineer encountered an unexpected challenge. Although the team designed a GaN power amplifier and low‑noise receiver chain to operate above 80 GHz, system testing revealed significant performance degradation. The active devices met their specifications, but once the signal left the die, system performance collapsed: Insertion loss exceeded the link budget by 1.5 dB Parasitic inductance from wire bonds and interconnects distorted matching Board-to-board variation caused gain and phase inconsistencies across flight units Commercial passive components were too large and introduced resonances above 70 GHz The design relied on an advanced organic PCB with thick‑film passives and LTCC modules. Despite extensive tuning and redesign cycles, performance drifted from build to build, introducing unacceptable risk to schedule and qualification.
Ready to solve a design challenge?
Our application engineers are available to discuss your requirements. Whether you have a finished spec or just a problem that needs solving, the right conversation starts here.