MALVERN, Pa. — Sep. 29, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new Automotive Grade top-side cooling mount thick film power resistor. Designed for automotive applications, the Vishay Sfernice D2TO35S improves thermal performance and reduces board space requirements, while delivering high power dissipation of 35 W at 25 °C in the surface-mount TO-263 (D2PAK) package.

As thermal constraints increasingly become the primary system design limitation, many power components are transitioning from PCB-based cooling to top-side cooled architectures. By transferring heat directly to a heatsink, the D2TO35S released today enables up to nine times greater power dissipation than standard PCB-mounted devices when paired with an appropriate heatsink. Its compact, surface-mount design allows designers to increase power dissipation within the same footprint or provide the same functionality in a smaller footprint, while lowering PCB temperatures, reducing thermal stress on neighboring components, and improving overall system reliability.

Offering a non-inductive design for improved signal integrity and power handling in fast transient conditions, the D2TO35S features a resistance range from 4.7 W to 550 kW — with tolerances down to ± 1 % — thermal resistance of 4.28 °C/W, TCR down to ± 150 ppm/°C, and a wide operating temperature range from -55 °C to +175 °C. The RoHS-compliant device is solder reflow secure at 270 °C/10 s.

Samples and production quantities of the D2TO35S are available now with lead times of fourteen weeks.

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.® Vishay Intertechnology, Inc. is a Fortune 1,000 Company listed on the NYSE (VSH). More on Vishay at www.vishay.com.