
FlatPAK HC0 Transfer Mold Power Module Half Bridge - Power MOSFET, 200 A
FlatPAK HC0 Transfer Mold Power Module Half Bridge - Power MOSFET, 200 A
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Features
- Half bridge inverter
- Current sensing and temperature sensing
- Electrically isolated exposed DBC substrate
- C snubber for low EMI
- Qualified according to AQG324 guidelines
- PPAP capable
- Epoxy compound UL 94 V-0 certified
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