Ultrafast Rectifier Surface-Mount

Applications

• For surface mounted applications
• Low profile package
• Ideal for automated placement
• Glass passivated pellet chip junction
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Meets JESD 201 class 2 whisker test
• Wave and reflow solderable
• AEC-Q101 qualified
• Compatible to SOD-123W package case outline or SOD-123F and SOD-123FL