ESD Protection Diode in LLP1006-2L

Applications

• Ultra compact LLP1006-2L package
• Low package height < 0.4 mm
• 1-line ESD protection
• Low leakage current < 0.1 µA
• Low load capacitance CD = 12 pF (VR = 2.5 V; f = 1 MHz)
• ESD immunity acc. IEC 61000-4-2 ± 30 kV contact discharge ± 30 kV air discharge
• High surge current acc. IEC 61000-4-5 IPP > 3 A
• Soldering can be checked by standard vision inspection. No X-ray necessary
• Pin plating NiPdAu (e4) no whisker growth
• e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)