Suitable for solderable, epoxy bondable, or wire bondable applications
Termination material: gold, platinum silver, platinum palladium gold or solder coated non-magnetic terminations available
Multiple styles, termination materials and configurations, allow wide design flexibility
Epoxy bondable or wire bondable non-magnetic terminations available
Flow solderable
Custom sizes available
Burn-in data available
Automatic placement capability
Termination style: 3-sided wraparound termination or single termination flip chip standard; 5-sided wraparound termination available
Tape and reel packaging available
Internationally standardized sizes
Standard solder plating for the non-magnetic parts are solder terminations E or T. Hot solder dipped terminations F or S are also available.
Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring solderable mounting.
While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver. If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for solderability and/or solder joint issues.
Applications
Suitable for solderable, epoxy bondable, or wire bondable applications
Termination material: gold, platinum silver, platinum palladium gold or solder coated non-magnetic terminations available
Multiple styles, termination materials and configurations, allow wide design flexibility
Epoxy bondable or wire bondable non-magnetic terminations available
Flow solderable
Custom sizes available
Burn-in data available
Automatic placement capability
Termination style: 3-sided wraparound termination or single termination flip chip standard; 5-sided wraparound termination available
