Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectic or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip.)
Applications
Wire bondable
Only one wire bond required
Small size: 0.020 inches square
Resistance range: 10 Ω to 1 MΩ
Oxidized silicon substrate for good power dissipation
