Vishay EFI SFP small resistor chips are widely used in hybrid packages where space is limited and chip value marking is important for identification. The die is part marked with the resistance value. Wire bonding is made to the two pads on the top of the chip.
Applications
Wire bondable
Part marked - 5 digits
Small size: 0.022 inches square
Case: 0202
Resistance range: 1 Ω to 1 MΩ
DC power rating: 250 mW
Oxidized silicon substrate for good power dissipation
