Tin / Lead, 5 % DCR Tolerance, Low Profile, Power Inductor

Applications

• Lowest molded height (3.0 mm) in this package footprint
• Shielded construction
• Excellent DC/DC energy storage up to 5 MHz. Filter inductor applications up to SRF (see “Standard Electrical Specifications” table)
• Lowest DCR/µH, in this package size
• Handles high transient current spikes without saturation
• Ultra low buzz noise, due to composite construction
• Encapsulated body offers improved environmental protection and moisture resistance
• Higher dielectric withstanding voltage vs IHLP
• Flame retardant encapsulant (UL 94 V-0)
• Corrosion resistant package
• Tin / lead Sn / Pb plated (not dipped) terminals
• IHLP design;