Vishay's power module engineering team works with you to configure or create assemblies that standard topologies can't achieve. Whether you need a modified pinout, a non-standard die combination, or a fully application-specific module for a demanding application, we have the process, materials, and manufacturing scale to deliver it.
Two Ways to Work with Our Power Modules Team
Re-configure an existing power module
Start from one of Vishay's existing module families and work with our engineers to adapt it to your specific requirements. Faster to qualify, lower NRE cost, and suitable for designs where a standard topology gets you most of the way there.
Common modification requests
- Re-configured pinout or terminal configuration
- Non-standard die combinations within an existing package
- Modified substrate material for thermal performance
- Alternative isolation voltage or current rating
- Package labeling or marking to customer specification
Design an application-specific power module from scratch
When your application demands a topology, form factor, or performance envelope that no existing module can meet, our engineering team designs from the ground up. From initial spec through prototype validation and into volume production.
Common new-design requests
- Multi-die assemblies with mixed semiconductor technologies
- Application-specific transfer-molded or open-frame packages
- Application-specific thermal management integration
- High-reliability designs for automotive, aerospace, or medical
- SiC-based topologies for EV, solar, or industrial inverter applications
Here is what the experience looks like from your side.
You submit a request
A brief description of your project is all that is needed to start. Our team will ask for more detail once we have reviewed what you have shared.
An engineer reaches out
A member of our engineering team will contact you directly to discuss your requirements, ask questions, and assess whether your project is a good fit for our capabilities.
You decide how to proceed
If the project is feasible, we will present a recommended approach. There is no commitment at any stage until you choose to move forward.
Proof Through Case Studies
Power Module solutions we have delivered.
Avoiding a Complete Redesign After a Panel Potentiometer was Made Obsolete
Challenge
The customer approached Vishay when their existing panel potentiometer supplier discontinued production of a part used on an established and popular piece of equipment. To avoid a costly redesign, an existing panel potentiometer needed to be adapted to meet the customer’s electrical requirements. It would also have to fit the control panel insertion / retention envelope and existing markings, in addition to the PCB assembly attachment system.
DC-Link Capacitors With Tab Terminals For Harsh Vibration Profiles
Challenge
Our customer was evaluating a solution for power electronics equipment that required the use of several DC-Link capacitors on the same PCB, while ensuring that the devices would support critical vibration profiles. The products being considered for the application had a significantly high mass of around 100 g, and were attached to the PCB via four lead wires with 1.2 mm diameters. While testing these parts under severe vibration profiles, the customer reported broken lead wires. The challenge was clear: how can such high mass parts withstand severe vibration profiles, while maintaining a similar footprint on the PCB?
mmWave Loss and Unstable Performance in a Satellite Payload
Challenge
While developing a next‑generation Ka‑band and W‑band satellite payload for a low‑Earth‑orbit communications constellation, an RF systems engineer encountered an unexpected challenge. Although the team designed a GaN power amplifier and low‑noise receiver chain to operate above 80 GHz, system testing revealed significant performance degradation. The active devices met their specifications, but once the signal left the die, system performance collapsed: Insertion loss exceeded the link budget by 1.5 dB Parasitic inductance from wire bonds and interconnects distorted matching Board-to-board variation caused gain and phase inconsistencies across flight units Commercial passive components were too large and introduced resonances above 70 GHz The design relied on an advanced organic PCB with thick‑film passives and LTCC modules. Despite extensive tuning and redesign cycles, performance drifted from build to build, introducing unacceptable risk to schedule and qualification.
Ready to discuss a application-specific power module?
Tell us about your application and a Vishay application engineer will follow up to discuss requirements, feasibility, and next steps. There is no commitment required to start the conversation.
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