
Product Details
Features
- Low profile package
- Ideal for automated placement
- Oxide planar chip junction
- Low forward voltage drop, low leakage current
- ESD capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Wave and reflow solderable
- AEC-Q101 qualified available - Automotive ordering code: base P/NHM3
- Compatible to SOD-123W package case outline
Applications
- General purpose, power line polarity protection, in commercial, industrial, and automotive applications.
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