High Reliability Thick Film Resistor, Surface-Mount Chip

Features

• High purity alumina substrate for high power dissipation (2 W max.)
• Wraparound terminations featuring a thin film adhesion layer covered with a leach resistant nickel barrier layer for +150 °C operating conditions
• High speed laser trimming for high volume requirements
• Ruthenium based cermet thick film for dependable performance
• Fired-on glass passivation
• Tape and reel packaging standard; static-free waffle pack available
• Active trim and 0 Ω chips
• Sulfur resistant (per ASTM B809-95 humid vapor test)