Enhanced Leadless NTC Thermistor Die Suitable For Wire Bonding image

Enhanced Leadless NTC Thermistor Die Suitable For Wire Bonding

Enhanced Leadless NTC Thermistor Die Suitable For Wire Bonding

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Product Details

Features

Flat chip contacted top and bottom (NTCC201E4 series)
Green thermistor - does not use RoHS exemptions
Wide temperature range from -55 °C to +175 °C (resistant to repetitive short periods at 200 °C, as for example, 10 times 10 s)
Highly resistant to mounting conditions
Ideal for aluminum wire
Resistance to leaching during reflow soldering process
Delivered on blister tape
AEC-Q200 qualified

Applications

High temperature sensing, control and compensation in power semiconductor modules (e.g. IGBT, SiC MOSFET, Diodes, …), inverters in EV/HEV vehicles, and windmills
IC and semiconductor protecting
DC/AC power inverters and HIC overheat protecting

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