Leadless NTC Thermistor Die Intended for Wire Bonding image

Leadless NTC Thermistor Die Intended for Wire Bonding

Leadless NTC Thermistor Die Intended for Wire Bonding

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Product Details

Features

Flat chip contacted top and bottom (silver)
Wide temperature range from -55 °C to +175 °C
Specified at 100 °C for better temp. control
Highly resistant to thermal shocks
Ideal for wire bonding (aluminum or gold depending on metalization type)
Delivered on blister tape

Applications

High temperature sensing, control and compensation. E.g. IGBT modules (inverters in EV and HEV vehicles)
IC and semiconductor protecting
DC/AC power inverters and HIC overheat protecting

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